TY  - BOOK
AU  - Cornet,Charles
AU  - L�eger,Yoan
AU  - Robert,Cedric
TI  - Integrated lasers on silicon
T2  - Advances lasers set
SN  - 9780081010761
AV  - TK7871.15.S55 
U1  - 621.3815/2 23
PY  - 2016///
CY  - [London], Kidlington, Oxford
PB  - ISTE Press, Ltd., Elsevier
KW  - Silicon
KW  - Effect of lasers on
KW  - TECHNOLOGY & ENGINEERING
KW  - Mechanical
KW  - bisacsh
KW  - Electronic books
N1  - Includes bibliographical references and index; Front Cover ; Integrated Lasers on Silicon; Copyright ; Contents; Preface; Introduction; Chapter 1: Laser Integration Challenges; 1.1. Evolution of microprocessor technologies; 1.2. Photonic integration schemes; 1.3. Semiconductor lasers; Chapter 2: Group IV Silicon Lasers; 2.1. Group IV silicon lasers: issues; 2.2. Emission from bulk silicon; 2.3. Using quantum confinement; 2.4. Raman scattering for lasing; 2.5. Rare-earth doping; 2.6. Group IV SiGeSn alloys for lasing; Chapter 3: III-V Lasers Bonded on Si; 3.1. Introduction; 3.2. Historical flip-chip bonding technology: advantages and drawbacks3.3. Die versus wafer bonding; 3.4. Basic principles of wafer bonding; 3.5. Basic principles of transfer printing ; 3.6. Device structures and performances of III-V lasers coupled to SOI waveguides; 3.7. Conclusion; Chapter 4: Monolithic III-V Lasers on Silicon; 4.1. The monolithic integration: issues and strategies; 4.2. Monolithic devices; Chapter 5: Laser Architectures for On-chip Information Technologies; 5.1. The role of integrated lasers in hybrid photonic- electronic chips; 5.2. Laser designs for on-chip routing; 5.3. Concluding remarksConclusion; Bibliography; Index; Back Cover
N2  - Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment. Features a clear description of the advantages, drawbacks, and challenges of laser integration on silicon Serves as a staple reference in the general field of silicon photonics Focuses on the promising developments of hybrid and monolithic III-V lasers on silicon, previously unreviewed Discusses the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment
UR  - http://www.sciencedirect.com/science/book/9781785480621
ER  -