TY  - BOOK
AU  - International symposium on advances in electronic circuit packaging (5th: 1964: Aug 19-21: Colorado)
TI  - Advances in electronic circuit packaging: proceedings of the third international symposiums sponsored by the University of Colorado and electrical design news
U1  - 621.381 5 
PY  - 1965///
CY  - New York
PB  - Plenum Press
KW  - Electronic circuits-packaging-symposium
ER  -