TY  - BOOK
TI  - Advances in electronic circuit packaging: proceedings of the third international symposiums sponsored by the University of Colorado and electrical design news
U1  - 621.381 5 ADV 5 
PY  - 1963///.
CY  - New York : 
PB  - Plenum Press, 
KW  - Electronic circuits-packaging-symposium
ER  -