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Advances in electronic circuit packaging: proceedings of the third international symposiums sponsored by the University of Colorado and electrical design news

By: International symposium on advances in electronic circuit packaging (5th: 1964: Aug 19-21: Colorado)Material type: TextTextLanguage: English Publication details: New York Plenum Press 1965Description: 5v 26 cmSubject(s): Electronic circuits-packaging-symposiumDDC classification: 621.381 5
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