Normal view MARC view ISBD view

Advances in electronic circuit packaging: proceedings of the third international symposiums sponsored by the University of Colorado and electrical design news

Material type: Text

TextLanguage: English Publication details: New York : Plenum Press, 1965Description: 5 v. (284 p.) ; 26 cmSubject(s): Electronic circuits-packaging-symposiumDDC classification: 621.381 5 ADV 5

Item type:

Tags from this library: No tags from this library for this title. Log in to add tags.

Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books	Mysore University Main Library	621.381 5 ADV 5 (Browse shelf (Opens below))	Available		223363

Previous	No cover image available	No cover image available	No cover image available	No cover image available	No cover image available	No cover image available	No cover image available	Next
Previous	621.381 5 ADV 1 Advances in electronic circuit packaging	621.381 5 ADV 4 Advances in electronic circuit packaging	621.381 5 ADV 5 Advances in electronic circuit packaging: proceedings of the third international symposiums sponsored by the University of Colorado and electrical design news	621.381 5 ADV 5 Advances in electronic circuit packaging: proceedings of the third international symposiums sponsored by the University of Colorado and electrical design news	621.381 5 ANG 2 Electronic circuits	621.381 5 BAP Electronic devices and circuits	621.381 5 BEN W Industrial electronic circuits and applications	Next